Display device

ABSTRACT

A display device including a display area and a non-display area, the display device including a plurality of data wires disposed in the display area and in the non-display area, a plurality of connecting wires disposed in the display area and connected to the data wires, a plurality of dummy patterns disposed in the display area in the same layer as the connecting wires, and shielding patterns disposed on the connecting wires. First gaps are defined between the connecting wires and the dummy patterns, and the shielding patterns overlap with the first gaps.

CROSS-REFERENCE TO RELATED APPLICATIONS

This application is a Divisional of U.S. patent application Ser. No.16/729,440, filed on Dec. 29, 2019, which claims priority from thebenefit of Korean Patent Application No. 10-2019-0016318, filed on Feb.12, 2019, each of which is incorporated by reference for all purposes asif fully set forth herein.

BACKGROUND Field

Exemplary embodiments of the invention relate generally to a displaydevice.

Discussion of the Background

Display devices have increasingly become of great importance with thedevelopment of multimedia. Accordingly, various display devices, such asa liquid crystal display (LCD) device, an organic light-emitting diode(OLED) display device, or the like have been developed.

Particularly, the OLED display device displays an image using OLEDswhich generate light by combining electrons and holes together. The OLEDdisplay device has a fast response speed, high luminance, and wideviewing angles and can be driven at low power.

A typical display device displays images only at the front thereof, andrecently, a display device capable of displaying images on the sidesthereof has been developed.

The above information disclosed in this Background section is only forunderstanding of the background of inventive concepts, and, therefore,it may contain information that does not constitute prior art.

SUMMARY

Exemplary embodiments of the invention provide a display device capableof minimizing the size of a non-display area and preventing degradationof display quality.

Additional features of the inventive concepts will be set forth in thedescription which follows, and in part will be apparent from thedescription, or may be learned by practice of the inventive concepts.

An exemplary embodiment of the invention provides a display deviceincluding a display area and a non-display area, the display deviceincluding a plurality of data wires disposed in the display area and inthe non-display area, a plurality of connecting wires disposed in thedisplay area and connected to the data wires, a plurality of dummypatterns disposed in the display area in the same layer as theconnecting wires, and shielding patterns disposed on the connectingwires. First gaps are defined between the connecting wires and the dummypatterns, and the shielding patterns overlap with the first gaps.

It is to be understood that both the foregoing general description andthe following detailed description are exemplary and explanatory and areintended to provide further explanation of the invention as claimed.

BRIEF DESCRIPTION OF THE DRAWINGS

The accompanying drawings, which are included to provide a furtherunderstanding of the invention and are incorporated in and constitute apart of this specification, illustrate exemplary embodiments of theinvention, and together with the description serve to explain theinventive concepts.

FIG. 1 is a perspective view of a display device according to anexemplary embodiment of the invention.

FIG. 2 is a development view of the display device of FIG. 1 .

FIG. 3 is a cross-sectional view taken along line III-III′ of FIG. 2 .

FIG. 4 is a plan view of a touch sensing layer according to an exemplaryembodiment of the invention.

FIG. 5 is an enlarged plan view of an area FF1 of FIG. 4 .

FIG. 6 is a plan view of the display device of FIG. 1 .

FIG. 7 is a cross-sectional view taken along line VII-VII′ of FIG. 6 .

FIG. 8 is an enlarged plan view of an area A of FIG. 6 .

FIG. 9 is a plan view illustrating how a touch sensing layer is arrangedover the structure of FIG. 8 .

FIG. 10 is a cross-sectional view taken along line X-X′ of FIG. 9 .

FIG. 11 is a plan view of a display device according to anotherexemplary embodiment of the invention.

FIG. 12 is an enlarged plan view of an area A of FIG. 11 .

FIG. 13 is a plan view of a display device according to anotherexemplary embodiment of the invention.

FIG. 14 is an enlarged plan view of an area A of FIG. 13 .

FIG. 15 is a plan view of a display device according to anotherexemplary embodiment of the invention.

FIG. 16 is an enlarged plan view of an area A of FIG. 15 .

FIG. 17 is a plan view of a display device according to anotherexemplary embodiment of the invention.

FIG. 18 is an exemplary cross-sectional view taken along lineXVIII-XVIII′ of FIG. 17 .

FIG. 19 is another exemplary cross-sectional view taken along lineXVIII-XVIII′ of FIG. 17 .

DETAILED DESCRIPTION

Features of the inventive concept and methods of accomplishing the samemay be understood more readily by reference to the following detaileddescription of exemplary embodiments and the accompanying drawings. Theinventive concept may, however, be embodied in many different forms andshould not be construed as being limited to the exemplary embodimentsset forth herein. Rather, these exemplary embodiments are provided sothat this disclosure will be thorough and complete and will fully conveythe concept of the inventive concept to those skilled in the art, andthe inventive concept will only be defined by the appended claims.

When an element, such as a layer, is referred to as being “on,”“connected to,” or “coupled to” another element or layer, it may bedirectly on, connected to, or coupled to the other element or layer orintervening elements or layers may be present. When, however, an elementor layer is referred to as being “directly on,” “directly connected to,”or “directly coupled to” another element or layer, there are nointervening elements or layers present. To this end, the term“connected” may refer to physical, electrical, and/or fluid connection,with or without intervening elements. Further, the D1-axis, the D2-axis,and the D3-axis are not limited to three axes of a rectangularcoordinate system, such as the x, y, and z-axes, and may be interpretedin a broader sense. For example, the D1-axis, the D2-axis, and theD3-axis may be perpendicular to one another, or may represent differentdirections that are not perpendicular to one another. For the purposesof this disclosure, “at least one of X, Y, and Z” and “at least oneselected from the group consisting of X, Y, and Z” may be construed as Xonly, Y only, Z only, or any combination of two or more of X, Y, and Z,such as, for instance, XYZ, XYY, YZ, and ZZ. As used herein, the term“and/or” includes any and all combinations of one or more of theassociated listed items.

Although the terms “first,” “second,” etc. may be used herein todescribe various types of elements, these elements should not be limitedby these terms. These terms are used to distinguish one element fromanother element. Thus, a first element discussed below could be termed asecond element without departing from the teachings of the disclosure.

Spatially relative terms, such as “beneath,” “below,” “under,” “lower,”“above,” “upper,” “over,” “higher,” “side” (e.g., as in “sidewall”), andthe like, may be used herein for descriptive purposes, and, thereby, todescribe one elements relationship to another element(s) as illustratedin the drawings. Spatially relative terms are intended to encompassdifferent orientations of an apparatus in use, operation, and/ormanufacture in addition to the orientation depicted in the drawings. Forexample, if the apparatus in the drawings is turned over, elementsdescribed as “below” or “beneath” other elements or features would thenbe oriented “above” the other elements or features. Thus, the exemplaryterm “below” can encompass both an orientation of above and below.Furthermore, the apparatus may be otherwise oriented (e.g., rotated 90degrees or at other orientations), and, as such, the spatially relativedescriptors used herein interpreted accordingly.

The terminology used herein is for the purpose of describing particularembodiments and is not intended to be limiting. As used herein, thesingular forms, “a,” “an,” and “the” are intended to include the pluralforms as well, unless the context clearly indicates otherwise. Moreover,the terms “comprises,” “comprising,” “includes,” and/or “including,”when used in this specification, specify the presence of statedfeatures, integers, steps, operations, elements, components, and/orgroups thereof, but do not preclude the presence or addition of one ormore other features, integers, steps, operations, elements, components,and/or groups thereof. It is also noted that, as used herein, the terms“substantially,” “about,” and other similar terms, are used as terms ofapproximation and not as terms of degree, and, as such, are utilized toaccount for inherent deviations in measured, calculated, and/or providedvalues that would be recognized by one of ordinary skill in the art.

Various exemplary embodiments are described herein with reference tosectional and/or exploded illustrations that are schematic illustrationsof idealized exemplary embodiments and/or intermediate structures. Assuch, variations from the shapes of the illustrations as a result, forexample, of manufacturing techniques and/or tolerances, are to beexpected. Thus, exemplary embodiments disclosed herein should notnecessarily be construed as limited to the particular illustrated shapesof regions, but are to include deviations in shapes that result from,for instance, manufacturing. In this manner, regions illustrated in thedrawings may be schematic in nature and the shapes of these regions maynot reflect actual shapes of regions of a device and, as such, are notnecessarily intended to be limiting.

Unless otherwise defined, all terms (including technical and scientificterms) used herein have the same meaning as commonly understood by oneof ordinary skill in the art to which this disclosure is a part. Terms,such as those defined in commonly used dictionaries, should beinterpreted as having a meaning that is consistent with their meaning inthe context of the relevant art and should not be interpreted in anidealized or overly formal sense, unless expressly so defined herein.

It will be understood that when an element or layer is referred to asbeing “on”, “connected to” or “coupled to” another element or layer, itcan be directly on, connected or coupled to the other element or layeror intervening elements or layers may be present. In contrast, when anelement is referred to as being “directly on”, “directly connected to”or “directly coupled to” another element or layer, there are nointervening elements or layers present. As used herein, the term“and/or” includes any and all combinations of one or more of theassociated listed items.

Spatially relative terms, such as “beneath,” “below,” “lower,” “above,”“upper” and the like, may be used herein for ease of description todescribe one element or feature's relationship to another element(s) orfeature(s) as illustrated in the figures. It will be understood that thespatially relative terms are intended to encompass differentorientations of the device in use or operation in addition to theorientation depicted in the figures. For example, if the device in thefigures is turned over, elements described as “below” or “beneath” otherelements or features would then be oriented “above” the other elementsor features. Thus, the exemplary term “below” can encompass both anorientation of above and below. The device may be otherwise oriented(rotated 90 degrees or at other orientations) and the spatially relativedescriptors used herein interpreted accordingly.

It will be understood that, although the terms first, second, etc. maybe used herein to describe various elements, components, regions, layersand/or sections, these elements, components, regions, layers and/orsections should not be limited by these terms. These terms are only usedto distinguish one element, component, region, layer or section fromanother region, layer or section. Thus, a first element, component,region, layer or section discussed below could be termed a secondelement, component, region, layer or section without departing from theteachings of the inventive concept.

Exemplary embodiments of the invention will hereinafter be describedwith reference to the accompanying drawings.

FIG. 1 is a perspective view of a display device according to anexemplary embodiment of the invention. FIG. 2 is a development view ofthe display device of FIG. 1 .

Referring to FIGS. 1 and 2 , a display device 1 may display images. Forexample, the display device 1 may be an organic light-emitting diode(OLED) display, a liquid crystal display (LCD) device, a plasma displaypanel (PDP) device, a field emission display (FED) device, or anelectrophoretic display (EPD) device. The display device 1 willhereinafter be described as being, for example, an OLED device, but theinventive concept is not limited thereto.

The display device 1 may be applied not only to portable electronicdevices, such as a mobile phone, a smartphone, a tablet personalcomputer (PC), a smartwatch, a watch phone, a mobile communicationterminal, an electronic notebook, an electronic book (e-book) reader, aportable multimedia player (PMP), a navigation device, or anultra-mobile PC (UMPC), but also to various other products, such as atelevision (TV), a notebook computer, a monitor, a billboard, or anInternet-of-things (IoT) device.

The display device 1 may include a main display surface 10 and aplurality of sub-display surfaces (11 through 14).

The main display surface 10 may generally have a plate shape and may bedisposed on one plane of the display device 1, and may account for thelargest area (or size) among all the display surfaces of the displaydevice 1. For example, the main display surface 10 may be located on thetop surface of the display device 1. The main display surface 10 mayhave various planar shapes, such as a polygonal shape (e.g., arectangular shape), a circular shape, or an elliptical shape.

The plurality of sub-display surfaces (11 through 14) may be located ondifferent planes from the main display surface 10. Each of the pluralityof sub-display surfaces (11 through 14) may have a smaller area than themain display surface 10, and the plurality of sub-display surfaces (11through 14) may be located on different planes from one another. Theplurality of sub-display surfaces (11 through 14) may be connected tothe sides of the main display surface 10 and may be bent or folded fromthe main display surface 10 (or from the sides of the main displaysurface 10).

For example, in a case where the main display surface 10 has arectangular shape, the display device 1 may include first through fourthsub-display surfaces 11 through 14, and the first through fourthsub-display surfaces 11 through 14 may be connected to the four sides ofthe main display surface 10.

The first sub-display surface 11 may be connected to a first long sideof the main display surface 10 and may be bent vertically from the maindisplay surface 10 to form a left side surface of the display device 1.Similarly, the second sub-display surface 12 may be connected to asecond long side of the main display surface 10 and may be bentvertically from the main display surface 10 to form a right side surfaceof the display device 1. The third sub-display surface 13 may beconnected to a first short side of the main display surface 10 to forman upper side surface of the display surface 10, and the fourthsub-display surface 14 may be connected to a second short side of themain display surface 10 to form a lower side surface of the displaysurface 10.

In this case, the display device 1 may be a stereoscopic display devicecapable of displaying images on the top surface and the side surfacesthereof. FIG. 2 illustrates that the bottom surface of the displaydevice 1 does not include a display surface, but the inventive conceptis not limited thereto. Alternatively, the display device 1 may includea bottom surface capable of displaying images.

The display device 1 may include a display area DA and a non-displayarea NDA. The display area DA, which is an area where images aredisplayed, may include a plurality of pixels PX, which are the smallestunits for displaying an image. The non-display area NDA, which is anarea where no images are displayed, may not include pixels PX, and willbe described later in detail.

The display area DA may include a main display area DA0 and firstthrough fourth sub-display areas DA1 through DA4.

The main display area DA0 may be located on the main display surface 10.For example, the main display surface 10 may include only the maindisplay area DA0. The first sub-display area DA1 may be located on thefirst sub-display surface 11 and may be connected to the main displayarea DA0. Similarly, the second through fourth display areas DA2 throughDA4 may be located on the second through fourth sub-display surfaces 12through 14, respectively, and may be connected to the main display areaDA0.

In a development view of the display device 1, the non-display area NDAmay be disposed along the sides of the display area DA (or along theoutermost edges of the display area DA including the main displaysurface 10 and the first through fourth sub-display surfaces 11 through14). In the non-display area NDA, driving wires and driving circuits maybe disposed. The non-display area NDA may include a decoration ink and ablack matrix for preventing leakage light, but the inventive concept isnot limited thereto.

The non-display area NDA may include first through fourth non-displayareas (or first through fourth sub-non-display areas) NDA1 through NDA4.The first non-display area NDA1 may be located on the first sub-displaysurface 11. Similarly, the second through fourth non-display areas NDA2through NDA4 may be located on the second through fourth non-displaysurfaces 12 through 14, respectively.

The non-display area NDA may include first through fourth corner wings21 through 24. The first through fourth corner wings 21 through 24 maybe disposed adjacent to the corners of the main display surface 10(where pairs of adjacent sides of the main display surface 10 meet). Thefirst through fourth corner wings 21 through 24 may be substantially thesame except for their locations. The characteristics of the firstthrough fourth corner wings 21 through 24 will hereinafter be described,taking the first corner wing 21 as an example.

The first corner wing 21 may protrude outwardly from one of the cornersof the main display surface 10. The first corner wing 21 may be disposedbetween the first and fourth sub-display surfaces 11 and 14 (or betweenthe first and fourth sub-display areas DA1 and DA4) and may alleviatethe angle between the first and fourth sub-display surfaces 11 and 14into an obtuse angle. One end of the first corner wing 21 may bedisposed on the first sub-display surface 11, and the other end of thefirst corner wing 21 may be disposed on the fourth sub-display surface14.

The first corner wing 21 may provide space for arranging signal wires orwhich is passed through by signal wires. In a case where the first andfourth sub-display surfaces 11 and 14 are bent, the first corner wing 21may be folded inwardly (i.e., in a direction toward the inner space ofthe display device 1 or toward the center of gravity of the displaydevice 1). In this case, the first corner wing 21 may be bent along abending line 20 so that both ends of the first corner wing 21 that areadjacent to the first and fourth sub-display surfaces 11 and 14) mayface each other. Both ends of the first corner wing 21 may be placed incontact with each other or may be coupled together by a coupling layeror the like.

Since the first corner wing 21 is folded inwardly when the first andfourth sub-display surfaces 11 and 14 are bent, the first corner wing 21may not be exposed, and similarly, the second, third, and fourth cornerwings 22, 23, and 24 may also not be exposed. Thus, the first throughfourth corner wings 21 through 24 may be included in the non-displayarea NDA.

The non-display area NDA may further include a driving area 30, and thedriving area 30 may be connected to at least one of the first throughfourth sub-display surfaces 11 through 14. For example, the driving area30 may be connected to one side of the fourth sub-display surface 14(e.g., the lower side of the fourth sub-display surface 14 in adevelopment view of the display device 1).

As illustrated in FIG. 1 , when the fourth sub-display surface 14 isbent perpendicularly from the main display surface 10, the driving area30 may be further bent perpendicularly from the fourth sub-displaysurface 14 (i.e., by an angle of 180° with respect to the main displaysurface 10) and may thus be disposed below the main display surface 10in a thickness direction from the main display surface 10. The drivingarea 30 may overlap with the main display surface 10 and may be parallelto the main display surface 10.

The display device 1 may include a driver chip 40 (or a pad portion inwhich the driver chip 40 is disposed and which is electrically connectedto the driver chip 40), and the driver chip 40 may be disposed in thedriving area 30. The driver chip 40 may generate driving signals fordriving the pixels PX and may provide the generated driving signals tothe display area DA (or to the pixels PX). For example, the driver chip40 may generate data signals for determining the emission luminances ofthe pixels PX and may provide the data signals to the pixels PX viadriving wires (not illustrated) formed in the driving area 30 and viadata wires (not illustrated) formed in the main display surface 10 andthe first through fourth sub-display surfaces 11 through 14.

The display device 1 may further include a touch driving circuit (notillustrated). The touch driving circuit may be connected to touchelectrodes of a touch sensing layer TSL. The touch driving circuitapplies driving signals to the touch electrodes and measures the staticcapacitances of the touch electrodes. The driving signals may be signalshaving multiple driving pulses. The touch driving circuit not only candetermine the presence of touch input based on the static capacitancesof the touch electrodes, but also can calculate the touch coordinates ofthe location where the touch input is entered.

FIG. 3 is a cross-sectional view taken along line III-III′ of FIG. 2 .

Referring to FIG. 3 , the display device 1 may include a substrate 101,a thin-film transistor (TFT) layer TFTL, a light-emitting element layerEML, a thin-film encapsulation layer TFEL, and the touch sensing layerTSL.

The substrate 101 may be a flexible substrate that is bendable,foldable, or rollable. For example, the flexible substrate may includepolyethersulphone (PES), polyacrylate (PA), polyarylate (PAR),polyetherimide (PEI), polyethylene naphthalate (PEN), polyethyleneterephthalate (PET), polyphenylene sulfide (PPS), polyallylate,polyimide (PI), polycarbonate (PC), cellulose triacetate (CAT),cellulose acetate propionate (CAP), or a combination thereof.

The TFT layer TFTL may be disposed on the substrate 101. In the TFTlayer TFTL, the TFTs of the pixels PX, scan lines, data lines, powerlines, scan control lines, and link lines connecting pads and the datalines may be formed. Each of the TFTs of the pixels PX may include agate electrode, a semiconductor layer, a source electrode, and a drainelectrode.

The TFT layer TFTL may be disposed in the display area DA and in thenon-display area NDA. Specifically, the TFTs of the pixels PX, the scanlines, the data lines, and the power lines may be disposed in thedisplay area DA, and the scan control lines and the link lines may bedisposed in the non-display area NDA.

The light-emitting element layer EML may be disposed on the TFT layerTFTL. The light-emitting element layer EML may include the pixels PX,each including a first electrode, an emission layer, and a secondelectrode, and a pixel-defining layer 176 defining the pixels PX (FIG.10 ). The emission layer may be an organic emission layer including anorganic material, in which case, the emission layer may include a holetransport layer, an organic light-emitting layer, and an electrontransport layer. In response to a predetermined voltage being applied tothe first electrode via the TFT layer TFTL and a cathode voltage beingapplied to the second electrode, holes and electrons may move from thehole transport layer and the electron transport layer to the organiclight-emitting layer and may combine together in the organiclight-emitting layer to emit light. The pixels PX of the light-emittingelement layer EML may be disposed in the display area DA.

The thin-film encapsulation layer TFEL may be disposed on thelight-emitting element layer EML. The thin-film encapsulation layer TFELprevents oxygen or moisture from infiltrating into the light-emittingelement layer EML. To this end, the thin-film encapsulation layer TFELmay include at least one inorganic film. The inorganic film may includea silicon nitride layer, a silicon oxynitride layer, a silicon oxidelayer, a titanium oxide layer, or an aluminum oxide layer, but theinventive concept is not limited thereto. Also, the thin-filmencapsulation layer TFEL protects the light-emitting element layer EMLagainst foreign materials, such as dust. To this end, the thin-filmencapsulation layer TFEL may include at least one organic film. Theorganic film may include an acrylic resin, an epoxy resin, a phenolicresin, a polyamide resin, or a PI resin, but the inventive concept isnot limited thereto.

The thin-film encapsulation layer TFEL may be disposed in both thedisplay area DA and the non-display area NDA. Specifically, thethin-film encapsulation layer TFEL may be disposed to cover thelight-emitting element layer EML in both the display area DA and thenon-display area NDA and to cover the TFT layer TFTL in the non-displayarea NDA.

The touch sensing layer TSL may be disposed on the thin-filmencapsulation layer TFEL. Since the touch sensing layer TSL can bedisposed directly on the thin-film encapsulation layer TFEL, thethickness of the display device 1 can be reduced as compared to a casewhere an additional touch panel including the touch sensing layer TSL isattached to the thin-film encapsulation layer TFEL.

The touch sensing layer TSL may include touch electrodes for detectingtouch input from a user in a capacitive manner and touch linesconnecting the touch electrodes. For example, the touch sensing layerTSL may detect touch input from the user in a self-capacitance manner ora mutual capacitance manner.

A cover window may be additionally disposed on the touch sensing layerTSL, in which case, the touch sensing layer TSL and the cover window maybe attached together by a transparent adhesive member. The touch sensinglayer TSL will hereinafter be described.

FIG. 4 is a plan view of a touch sensing layer according to an exemplaryembodiment of the invention. FIG. 5 is an enlarged plan view of an areaFF1 of FIG. 4 .

Referring to FIGS. 4 and 5 , the touch sensing layer TSL includes atouch sensing area TSA, which is for detecting touch input from theuser, and a touch peripheral area TPA, which is disposed on theperiphery of the touch sensing area TSA.

First touch signal lines TL1, second touch signal lines TL2, third touchsignal lines RL, and touch electrode pads TP may be disposed in thetouch peripheral area TPA.

First ends of the first touch signal lines TL1 may be connected to firsttouch electrodes TE disposed in the touch sensing area TSA. Second endsof the first touch signal lines TL1 may be connected to some of thetouch electrode pads TP disposed in a touch pad area. That is, the firsttouch signal lines TL1 connect the first touch electrodes TE disposed inthe touch sensing area TSA of the fourth display area DA4 and some ofthe touch electrode pads TP disposed in the touch pad area.

First ends of the second touch signal lines TL2 may be connected tofirst touch electrodes TE disposed in the touch sensing area TSA of thethird display area DA3. Second ends of the second touch signal lines TL2may be connected to some of the touch electrode pads TP disposed in thetouch pad area via the third non-display area NDA3 and the firstnon-display area NDA1. That is, the second touch signal lines TL2connect the first touch electrodes TE disposed in the touch sensing areaTSA of the third display area DA3 and some of the touch electrode padsTP disposed in the touch pad area.

First ends of the third touch signal lines RL may be connected to secondtouch electrodes RE disposed in the touch sensing area TSA of the seconddisplay area DA2. Second ends of the third touch signal lines RL may beconnected to the other touch electrode pads TP disposed in the touch padarea. That is, the third touch signal lines RL connect the second touchelectrodes RE disposed in the touch sensing area TSA of the seconddisplay area DA2 and the other touch electrode pads TP disposed in thetouch pad area.

The touch electrode pads TP may be disposed on one side of the displaydevice 1. A touch circuit board may be attached on the touch electrodepads TP via an anisotropic conductive film. As a result, the touchelectrode pads TP can be electrically connected to the touch circuitboard.

The touch sensing area TSA may be disposed in the display area DA andmay include the first touch electrodes TE, the second touch electrodesRE, and connecting electrodes BE.

The first touch electrodes TE may be spaced apart from the second touchelectrodes RE.

The first touch electrodes TE may be arranged in a plurality of columnsalong a first direction W1, and the second touch electrodes RE may bearranged in a plurality of rows along a second direction W2. In each ofthe plurality of columns, the first touch electrodes TE may beelectrically connected in the first direction W1. In each of theplurality of rows, the second touch electrodes RE may be electricallyconnected in the second direction W2.

The first touch electrodes TE and the second touch electrodes RE may beformed to have a diamond shape or a triangular shape in a plan view.Specifically, the first touch electrodes TE and the second touchelectrodes RE may have a triangular shape in a plan view near the edgesof the touch sensing area TSA, and may have a diamond shape in a planview in the rest of the touch sensing area TSA.

The first touch electrodes TE and the second touch electrodes RE may beformed as mesh-type electrodes, as illustrated in FIG. 5 . In a casewhere the touch sensing layer TSL including the first touch electrodesTE and the second touch electrodes RE is formed directly on thethin-film encapsulation layer TFEL, very large parasitic capacitancesmay be generated between the second electrode of the light-emittingelement layer EML and the first touch electrodes TE or the second touchelectrodes RE of the touch sensing layer TSL because of the secondelectrode of the light-emitting element layer EML being too close to thefirst touch electrodes TE or the second touch electrodes RE. Thus, thefirst touch electrodes TE or the second touch electrodes RE maypreferably be formed as mesh-type electrodes, as illustrated in FIG. 5 ,instead of being formed as non-patterned electrodes of a transparentoxide conductive layer, such as an indium tin oxide (ITO) or an indiumzinc oxide (IZO) layer.

The first touch electrodes TE and the second touch electrodes RE mayoverlap with the pixel-defining layer 176, as shown in FIG. 10 . As aresult, a decrease in the size of the openings of the pixels PX can beprevented.

The planar shape of the first touch electrodes TE and the second touchelectrodes RE in the touch sensing area TSA is not particularly limited.

In order to prevent the first touch electrodes TE and the second touchelectrodes RE from being short-circuited at intersections therebetween,pairs of adjacent first touch electrodes TE in the first direction W1may be electrically connected by the connecting electrodes BE throughfirst contact holes CNT1. In this case, the first touch electrodes TEand the second touch electrode RE may be disposed in the same layer, andthe connecting electrodes BE may be disposed in a different layer fromthe first touch electrodes TE and the second touch electrode RE.Accordingly, first touch electrodes TE electrically connected in thefirst direction W1 may be electrically insulated from second touchelectrodes RE electrically connected in the second direction W2.

For example, the first touch electrodes TE, the second touch electrodesRE, and the connecting electrodes BE may overlap with gaps G betweendummy patterns DP and connecting wires 146 or between the dummy patternsDP. That is, the gaps G, which are formed in the display area DA, may beblocked by the first touch electrodes TE, the second touch electrode RE,and the connecting electrodes BE, and as a result, the reflection ofexternal light by the gaps G can be prevented, and smudges caused by thegaps G can be prevented from becoming visible. This will be describedlater in detail.

Signal wires and connecting wires for transmitting driving signals willhereinafter be described.

FIG. 6 is a plan view of the display device of FIG. 1 . FIG. 7 is across-sectional view taken along line VII-VII′ of FIG. 6 . FIG. 8 is anenlarged plan view of an area A of FIG. 6 . FIG. 9 is a plan viewillustrating how a touch sensing layer is arranged over the structure ofFIG. 8 . FIG. 10 is a cross-sectional view taken along line X-X′ of FIG.9 .

Referring to FIGS. 6 through 10 , the display device 1 may include thedata wires 136, the connecting wires 146, driving wires 60, and thedummy patterns DP.

The display area DA of the display device 1 may include first and secondareas DAA and DAB. The first area DAA may be an area in which theconnecting wires 146 are disposed. The second area DAB may account forthe rest of the display area DA.

The data wires 136, the connecting wires 146, the driving wires 60, andthe dummy patterns DP may be arranged symmetrically with respect to areference axis (not illustrated) that extends in the first direction W1to penetrate the center of the display device 1. The data wires 136, theconnecting wires 146, the driving wires 60, and the dummy patterns DPwill hereinafter be described, taking, as an example, data wires 136,connecting wires 146, driving wires 60, and dummy patterns DP that areall relatively adjacent to the first sub-display surface 11.

The data wires 136 may include first through m-th data wires (or signalwires) D1 through Dm (where m is an integer of 3 or greater).

The first through m-th data wires D1 through Dm may extend in the firstdirection W1 and may be sequentially arranged along the second directionW2 to be a predetermined distance apart from one another. The firstthrough m-th data wires D1 through Dm may extend across the display areaDA. The first through k-th data wires D1 through Dk (where k is aninteger of 2 or greater and is smaller than m) may be disposed in asingle display surface together. In the description that follows, it isassumed that k is 7, and that m is greater than 14.

The connecting wires 146 may electrically connect some of the data wires136 and some of the driving wires 60. The connecting wires 146 may bedisposed in a different layer from the data wires 136 and may beinsulated from the data wires 136 by an insulating layer, and will bedescribed later with reference to FIG. 8 .

The connecting wires 146 may include first through k-th connecting wiresDM1 through DMk which correspond to the first through m-th data wires D1through Dm. When k=7, the connecting wires 146 may include first throughseventh connecting wires DM1 through DM7. The first through seventhconnecting wires DM1 through DM7 may correspond to the first throughseventh data wires D1 through D7, respectively, which are disposed onthe first sub-display surface 11.

The first through k-th connecting wires DM1 through DMk may extend fromthe fourth non-display area NDA4 of the fourth sub-display surface 14(e.g., from a lower part of the fourth non-display area NDA4) to firstends of the data wires 136 (e.g., to a lower part of the firstnon-display area NDA1 of the first sub-display surface 11 and the firstcorner wing 21) via the display area DA. The first through k-thconnecting wires DM1 through DMk may be a predetermined distance apartfrom one another. The distance between the first through k-th connectingwires DM1 through DMk may be the same as the distance between the datawires 136.

The first through k-th connecting wires DM1 through DMk may extend(e.g., in a leftward direction) from the fourth non-display area NDA4 ofthe fourth sub-display surface 14 (e.g., the lower part of the fourthnon-display area NDA4) first in the first direction W1 (e.g., an upwarddirection) and then in the second direction W2 to reach the first endsof the data wires 136 (i.e., to the lower part of the first non-displayarea NDA1 of the first sub-display surface 11).

That is, each of the first through k-th connecting wires DM1 through DMkmay include a first portion extending from the fourth non-display areaNDA4 in the first direction W1, a second portion extending from the endof the first portion in the second direction W2, and a third portionextending from the end of the second portion in the first direction W1(or in the opposite direction of the first direction W1).

As illustrated in FIG. 6 , the first portion of each of the firstthrough k-th connecting wires DM1 through DMk may overlap with one ofthe data wires 136 in the display area DA. For example, the firstportion of the first connecting wire DM1 may overlap with the eighthdata wire D8, and the first portion of the seventh connecting wire DM7may overlap with the fourteenth data wire D14. However, the inventiveconcept is not limited to this example. In another example, the firstportions of the first through k-th connecting wires DM1 through DMk maynot overlap with the data wires 136 in the display area DA.

Also, as illustrated in FIG. 6 , the third portion of each of the firstthrough k-th connecting wires DM1 through DMk may overlap with one ofthe data wires 136. For example, the third portion of the firstconnecting wire DM1 may overlap with the seventh data wire D7, and thethird portion of the second connecting wire DM2 may overlap with thesixth data wire D6.

The connecting wires 146 are illustrated as being bent at a right angle,but the inventive concept is not limited thereto.

The connecting wires 146 may not intersect one another, and instead,connecting wires 146 relatively distant from the first corner wing 21may be disposed to bypass connecting wires 146 relatively adjacent tothe first corner wing 21. For example, the first connecting wire DM1 maybe disposed to bypass the second connecting wire DM2. That is, as theconnecting wires 146 are closer to, for example, the first corner wing21, the locations at which the connecting wires 146 are bent becomecloser to the driving area 30, and as the connecting wires 146 are moredistant from the first corner wing 21, the locations at which theconnecting wires 146 are bent become more distant from the driving area30.

Since connecting wires 146 relatively distant from the first corner wing21 are disposed to bypass connecting wires 146 relatively close to thefirst corner wing 21, the connecting wires 146 may have differentlengths. For example, the second connecting wire DM2 may be longer thanthe first connecting wire DM1. That is, an (i+1)-th connecting wireDMi+1 (where i is a positive integer) may be longer than an i-thconnecting wire DMi.

For example, the connecting wires 146 may have the same resistance. Forexample, if the second connecting wire DM2 is longer than the firstconnecting wire DM1, the first connecting wire DM1 may have a greaterwidth than the second connecting wire DM2.

The connecting wires 146 may be connected one-on-one directly to thedata wires 136 via second contact holes CNT which are formed in thenon-display area NDA, particularly, in the lower part of the firstnon-display area NDA1 and in the second corner wing 22. For example, thefirst connecting wire DM1 may be electrically connected to the seventhdata wire D7, and the seventh connecting wire DM7 may be electricallyconnected to the first data wire D1. That is, the i-th connecting wireDMi may be electrically connected to the (k+1−i)-th data wire DMk+1−i.For example, as illustrated in FIG. 7 , the fifth data wire D5 may bedisposed on a fourth insulating layer 174, and the third through sixthconnecting wire DM3 through DM6 may be disposed on a fifth insulatinglayer 175 and may be insulated from the fifth data wire D5 by the fifthinsulating layer 175. The third connecting wire DM3 may extend to thefirst end of the fifth data wire D5 and may be electrically connected tothe fifth data wire D5 via a second contact hole CNT2 that exposes thefirst end of the fifth data wire D5 through the fifth insulating layer175.

The driving wires 60 include driving wires (or pad wires or padconnecting wires) 61 a through 67 a and 61 b through 67 b, and thedriving wires 61 a through 67 a and 61 b through 67 b may extend fromthe driver chip 40 (or from the pad portion where the driver chip 40 isdisposed) to the fourth non-display area NDA4 of the fourth sub-displaysurface 14 (or to a tangent 51 between the driving area 30 and thefourth sub-display surface 14).

The driving wires 61 a through 67 a and 61 b through 67 b may be dividedinto first and second driving wire groups 60 a and 60 b.

The driving wires 61 a through 67 a, which are included in the firstdriving wire group 60 a, may be disposed in a different layer from thedriving wires 61 b through 67 b, which are included in the seconddriving wire group 60 b, and may intersect the driving wires 61 bthrough 67 b in a plan view. The driving wires 61 a through 67 a may beinsulated from the driving wires 61 b through 67 b by an insulatinglayer.

The driving wires 61 a through 67 a may be electrically connected to thefirst through seventh data wires D1 through D7, respectively, via thefirst through seventh connecting wires DM1 through DM7, respectively,which are disposed on the first sub-display surface 11. The drivingwires 61 b through 67 b may be electrically connected to the eighththrough fourteenth data wires D8 through D14, respectively, via thedriving wires 61 b through 67 b, respectively, which are disposed on themain display surface 10.

As described above, the display device 1 may include the connectingwires 146, which are disposed to pass through the display area DA, andimage signals may be provided from the driver chip 40 to the data wires136 disposed on the first sub-display surface 11 (and on the secondsub-display surface 12) via the connecting wires 146. Accordingly, anyadditional dead space for connecting the data wires 136 disposed on thefirst sub-display surface 11 (and on the second sub-display surface 12)directly to the driving wires 60 is not needed. As a result, an increasein dead space can be prevented.

Also, since the second contact holes CNT2, which electrically connectthe data wires 136 and the connecting wires 146, are formed in thenon-display area NDA, the second contact holes CNT2 can be preventedfrom interfering with the pixels PX (or driving signals provided to thepixels PX). Accordingly, the display quality of the display device 1 canbe improved.

The dummy patterns DP will hereinafter be described.

The dummy patterns DP may be disposed in the first and second areas DAAand DAB of the display area DA. The dummy patterns DP may be disposed inthe same layer as the connecting wires 146. The dummy patterns DP mayinclude, for example, a metal, an alloy, a metal nitride, a conductivemetal oxide, and/or a transparent conductive material, and thesematerials may be used alone or in combination with one another. Forexample, the dummy patterns DP may include the same material as theconnecting wires 146, and the dummy patterns DP and the connecting wires146 may be formed at the same time.

For example, the dummy patterns DP may include first dummy patterns DP1and second dummy patterns DP2, and the first dummy patterns DP1 and thesecond dummy patterns Dp2 may be disposed in the first area DAA.

The first dummy patterns DP1 may extend in the first direction W1 in aplan view and may be disposed parallel to one another.

The first dummy patterns DP1 may be disposed between the second portionsof the first through k-th connecting wires DM1 through DMk. For example,the first dummy patterns DP1 may be disposed between the second portionsof the first and second connecting wires DM1 and DM2 and between thesecond portions of the sixth and seventh connecting wires DM6 and DM7.

As illustrated in FIG. 6 , the first dummy patterns DP1 may overlap withthe first through m-th data wires D1 through Dm in a plan view.Accordingly, the first dummy patterns DP1 may be aligned with the firstthrough k-th connecting wires DM1 through DMk. For example, first dummypatterns DP1 overlapping with the first data wire D1 may be aligned withthe seventh connecting wire DM7, and first dummy patterns DP1overlapping with the seventh data wire D7 may be aligned with the firstconnecting wire DM1.

The first dummy patterns DP1 may be disposed parallel to the firstportions of the first through k-th connecting wires DM1 through DMk.Also, the first dummy patterns DP1 may be disposed parallel to the thirdportions of the first through k-th connecting wires DM1 through DMk.

The distance between the first dummy patterns DP1 may be the same as thedistance in the second direction W2 between the first through k-thconnecting wires DM1 through DMk.

The second dummy patterns DP2 may extend in the second direction W2 in aplan view and may be disposed parallel to one another.

The second dummy patterns DP2 may be disposed between the first portionsof the first through k-th connecting wires DM1 through DMk and betweenthe third portions of the first through k-th connecting wires DM1through DMk. For example, the second dummy patterns DP2 may be disposedbetween the first portions of the first and second connecting wires DM1and DM2 and between the first portions of the sixth and seventhconnecting wires DM6 and DM7. Also, the second dummy patterns DP2 may bedisposed between the third portions of the first and second connectingwires DM1 and DM2 and between the third portions of the sixth andseventh connecting wires DM6 and DM7.

The second dummy patterns DP2 may be disposed parallel to the secondportions of the first through k-th connecting wires DM1 through DMk.Also, the second dummy patterns DP2 may be aligned with the secondportions of the first through k-th connecting wires DM1 through DMk.

The distance between the second dummy patterns DP2 may be the same asthe distance in the first direction W1 between the first through k-thconnecting wires DM1 through DMk.

For example, the first dummy patterns DP1 may have a smaller averagelength than the second dummy patterns DP2.

For example, the dummy patterns DP may further include third dummypatterns DP3 and fourth dummy patterns DP4, and the third dummy patternsDP3 and the fourth dummy patterns DP4 may be disposed in the second areaDAB.

The third dummy patterns DP3 may extend in the first direction W1 in aplan view and may be disposed parallel to one another. A plurality ofthird dummy patterns DP3 may be disposed between the fourth dummypatterns DP4 as island patterns.

As illustrated in FIG. 6 , the third dummy patterns DP3 may overlap withthe first through m-th data wires D1 through Dm in a plan view.Accordingly, the third dummy patterns DP3 may be aligned with the firstthrough k-th connecting wires DM1 through DMk and/or with the firstdummy patterns DP1. For example, third dummy patterns DP3 overlappingwith the first data wire D1 may be aligned with the seventh connectingwire DM7, and third dummy patterns DP3 overlapping with the seventh datawire D7 may be aligned with the first connecting wire DM1. Also, thirddummy patterns DP3 overlapping with the first data wire D1 may bealigned with the first dummy patterns DP1 overlapping with the firstdata wire D1.

The third dummy patterns DP3 may be disposed parallel to the firstportions of the first through k-th connecting wires DM1 through DMk.Also, the third dummy patterns DP3 may be disposed parallel to the thirdportions of the first through k-th connecting wires DM1 through DMk.Also, the third dummy patterns DP3 may be disposed parallel to the firstdummy patterns DP1.

The distance between the third dummy patterns DP3 may be the same as thedistance in the second direction W2 between the first through k-thconnecting wires DM1 through DMk. Also, the distance between the thirddummy patterns DP3 may be the same as the distance in the seconddirection W2 between the first dummy patterns DP1.

The length, in the first direction W1, of the third dummy patterns DP3may be the same as the length, in the first direction W1, of the firstdummy patterns DP1.

The fourth dummy patterns DP4 may extend in the second direction W2 in aplan view and may be disposed parallel to one another.

The fourth dummy patterns DP4 may be disposed parallel to the secondportions of the first through k-th connecting wires DM1 through DMk.Also, the fourth dummy patterns DP4 may be disposed parallel to thesecond dummy patterns DP2.

The distance between the fourth dummy patterns DP4 may be the same asthe distance in the first direction W1 between the first through k-thconnecting wires DM1 through DMk. Also, the distance between the fourthdummy patterns DP4 may be the same as the distance in the firstdirection W1 between the second dummy patterns DP2.

For example, the third dummy patterns DP3 may have a smaller averagelength than the fourth dummy patterns DP4.

As described above, since the dummy patterns DP include the first dummypatterns DP1, the second dummy patterns DP2, the third dummy patternsDP3, and the fourth dummy patterns DP4, the dummy patterns DP can form alattice pattern shape in and across the display area DA together withthe connecting wires 146. Accordingly, any differences in the shape ofpatterns between the first and second areas DAA and DAB can beminimized, and as a result, the connecting wires 146 can be preventedfrom becoming visible.

For example, the dummy patterns DP may not overlap with the firstthrough k-th connecting wires DM1 through DMk in a plan view.Accordingly, gaps G may be formed between the dummy patterns DP and thefirst through k-th connecting wires DM1 through DMk. For example, asillustrated in FIGS. 7 and 8 , gaps G may be formed between the firstdummy patterns DP1 and the second portions of the first through k-thconnecting wires DM1 through DMk. Also, gaps G may be formed between thesecond dummy patterns DP2 and the first portions (and/or the thirdportions) of the first through k-th connecting wires DM1 through DMk.Also, gaps G may be formed between the third dummy patterns DP3 and thesecond portions of the first through k-th connecting wires DM1 throughDMk. Also, gaps G may be formed between the fourth dummy patterns DP4and the second portions of the first through k-th connecting wires DM1through DMk.

The dummy patterns DP may not overlap with one another. Accordingly,gaps G may be formed between the dummy patterns DP. For example, thethird dummy patterns DP3 may not overlap with the fourth dummy patternsDP4 in a plan view, and gaps G may be formed between the third dummypatterns DP3 and the fourth dummy patterns DP4.

For example, as illustrated in FIG. 9 , the gaps G formed in the displaydevice 1 may overlap with the first touch electrodes TE, the secondtouch electrodes RE, and the connecting electrodes BE. That is, thefirst touch electrodes TE, the second touch electrodes RE, and theconnecting electrodes BE may block the gaps G formed in the display areaDA. Accordingly, the reflection of external light by the gaps G can beprevented, and smudges caused by the gaps G can be prevented frombecoming visible. As a result, the display quality of the display device1 can be further improved.

The arrangement of the first touch electrodes TE, the second touchelectrodes RE, and the connecting electrodes BE to overlap with the gapsG, however, is not particularly limited, and may vary.

The cross-sectional structure of the display device 1 will hereinafterbe described.

FIG. 10 is a cross-sectional view taken along line X-X′ of FIG. 9 .

Referring to FIG. 10 , the display device 1 may include the substrate101, a buffer layer 102, a semiconductor layer 105, a first insulatinglayer 171, a first gate conductive layer 110, a second insulating layer172, a second gate conductive layer 120, a third insulating layer 173, afirst source/drain conductive layer 130, the fourth insulating layer174, a second source/drain conductive layer 140, the fifth insulatinglayer 175, a first electrode layer 150, a light-emitting element layerEML (FIG. 3 ), and a second electrode layer 160. The TFTs of the pixelsPX may be formed in the semiconductor layer 105, the first insulatinglayer 171, the first gate conductive layer 110, the second insulatinglayer 172, and thus, the second gate conductive layer 120, and thesemiconductor layer 105, the first insulating layer 171, the first gateconductive layer 110, the second insulating layer 172, and the secondgate conductive layer 120 may be collectively referred to as a “drivingelement layer”.

The substrate 101 may support the layers disposed thereon. The substrate101 may be formed of an insulating material. The substrate 101 may beformed of an inorganic material such as glass or quartz or may be formedof an organic material, such as a PI resin. The substrate 101 may be arigid substrate or a flexible substrate.

The buffer layer 102 may be disposed on the substrate 101. The bufferlayer 102 may prevent the diffusion of impurity ions and theinfiltration of moisture or external air and may perform a surfaceplanarization function. The buffer layer 102 may include siliconnitride, silicon oxide, or silicon oxynitride. The buffer layer 102 maynot be provided depending on the type of the substrate 101 and how thesubstrate 101 is fabricated.

The semiconductor layer 105 may be disposed on the buffer layer 102. Thesemiconductor layer 105 may form the channels of the TFTs of the pixelsPX. The semiconductor layer 105 may include polycrystalline silicon.Portions of the semiconductor layer 105 (e.g., source/drain regions)that are connected to the source/drain electrodes of the TFTs of thepixels PX may be doped with impurity ions (e.g., p-type impurity ions).A trivalent dopant, such as boron (B), may be used as the source of thep-type impurity ions. The semiconductor layer 105 may include, insteadof polycrystalline silicon, monocrystalline silicon, low-temperaturepolycrystalline silicon, amorphous silicon, or an oxide semiconductor,such as indium tin zinc oxide (ITZO) or indium gallium zinc oxide(IGZO).

The first insulating layer 171 may be disposed on the semiconductorlayer 171. The first insulating layer 171 may be a gate insulating layerhaving a gate insulating function.

The first gate conductive layer 110 may be disposed on the firstinsulating layer 171. The first gate conductive layer 110 may includethe gate electrodes of transistors. The first gate conductive layer 110may include the first electrodes of storage capacitors Cst.

The first gate conductive layer 110 may include at least one metalselected from among molybdenum (Mo), aluminum (Al), platinum (Pt),palladium (Pd), silver (Ag), magnesium (Mg), gold (Au), nickel (Ni),neodymium (Nd), iridium (Ir), chromium (Cr), calcium (Ca), titanium(Ti), tantalum (Ta), tungsten (W), and copper (Cu).

The second insulating layer 172 may be disposed on the first gateconductive layer 110. The second insulating layer 172 may be aninterlayer insulating layer.

The second gate conductive layer 120 may be disposed on the secondinsulating layer 172. The second gate conductive layer 120 may includethe second electrodes of the storage capacitors Cst. The second gateconductive layer 120 may be disposed to overlap with the first gateconductive layer 110 with the second insulating layer 172 interposedtherebetween and thus to form the storage capacitors Cst. The secondgate conductive layer 120 may include the same material as the firstgate conductive layer 110.

The third insulating layer 173 may be disposed on the second gateconductive layer 120.

The first source/drain conductive layer 130 may be disposed on the thirdinsulating layer 173. The first source/drain conductive layer 130 mayinclude source electrodes 132 and drain electrodes 131, and the datawires 136 (of FIG. 6 ). The source electrodes 132 and drain electrodes131 may be electrically connected to the semiconductor layer 105 throughcontact holes that penetrate the second and third insulating layers 172and 173 to expose the semiconductor layer 105.

The first source/drain conductive layer 130 may include at least onemetal selected from among Mo, Al, Pt, Pd, Ag, Mg, Au, Ni, Nd, Ir, Cr,Ca, Ti, Ta, W, and Cu. The first source/drain conductive layer 130 maybe a single-layer film or a multilayer film. For example, the firstsource/drain conductive layer 130 may be formed to have a stackedstructure of Ti/Al/Ti, Mo/Al/Mo, Mo/AlGe/Mo, or Ti/Cu.

The fourth insulating layer 174 may be disposed on the firstsource/drain conductive layer 130, and the second source/drainconductive layer 140 may be disposed on the fourth insulating layer 174.

The second source/drain conductive layer 140 may include the connectingwires 146 (i.e., the first through k-th connecting wires DM1 throughDMk). The connecting wires 146 may be disposed to overlap with the datawires 136 (i.e., the first through m-th data wires D1 through Dm) in across-sectional view.

The second source/drain conductive layer 140 may include the dummypatterns DP. Gaps G may be formed between the dummy patterns DP orbetween the dummy patterns DP and the connecting wires 146.

The second source/drain conductive layer 140 may include the samemetal(s) as the first source/drain conductive layer 130.

The fifth insulating layer 175 may be disposed on the secondsource/drain conductive layer 140, and the first electrode layer 150 maybe disposed on the fifth insulating layer 175. The first electrode layer150 may include anode electrodes 151 of OLEDs, and the anode electrodes151 may be electrically connected to the drain electrodes 131 of thefirst transistors through contact holes that penetrate the fifth andfourth insulating layers 175 and 174.

The light-emitting element layer EML may be disposed on the firstelectrode layer 150 and may include the pixel-defining layer 176 and anorganic layer EL. The pixel-defining layer 176 may be disposed on theanode electrodes 151 and along the edges of each of the anode electrodes151 and may include openings which expose the first electrode layer 150.

The organic layer EL may be disposed in the openings of thepixel-defining layer 176. The organic layer EL may include an organiclight-emitting layer, a hole injection/transport layer, and an electroninjection/transport layer. The second electrode layer 160 (or thecathode electrodes of the OLEDs) may be disposed on the organic layer ELand on the pixel-defining layer 176. The second electrode layer 160 maybe a common electrode disposed in the entire display area DA of thedisplay device 1.

A passivation layer 180 may be disposed on the second electrode layer160. The passivation layer 180 may prevent moisture or oxygen frominfiltrating into the light-emitting element layer EML. The passivationlayer 180 may include at least one inorganic film and/or at least oneorganic film. The inorganic film may include at least one inorganicmaterial selected from among, for example, Al_(x)O_(y), TiO_(x),ZrO_(x), SiO_(x), AlO_(x)N_(y), Al_(x)N_(y), SiO_(x)N_(y), Si_(x)N_(y),ZnO_(x), and Ta_(x)O_(y). The organic film may be formed by polymerizingat least one monomer selected from the group consisting ofpentabromophenyl acrylate, 2-(9H-carbazol-9-yl)ethyl methacrylate,N-vinylcarbazole, bis(methacryloylthiophenyl)sulfide, and zirconiumacrylate. The organic film may be a planarization film.

The touch sensing layer TSL may be disposed on the passivation layer180.

The touch sensing layer TSL may include a first touch conductive layer,a first touch insulating layer 191, a second touch conductive layer, anda second touch insulating layer 192. The touch sensing layer TSL mayfurther include a buffer layer (not illustrated) which is disposed belowthe first touch conductive layer for forming the first touch conductivelayer, the first touch insulating layer 191, the second touch conductivelayer, and the second touch insulating layer 192, but the inventiveconcept is not limited thereto.

Each of the first and second touch conductive layers may have asingle-layer structure or a multilayer structure consisting of two ormore layers. When formed to have a single-layer structure, each of thefirst and second touch conductive layers may include a metal layer or atransparent conductive layer. The metal layer may include Mo, Ag, Ti,Cu, Al, or an alloy thereof. The transparent conductive layer mayinclude a transparent conductive oxide such as ITO, IZO, zinc oxide(ZnO), or ITZO. The transparent conductive layer may also include aconductive polymer such as PEDOT, metal nanowire, or graphene. Whenformed to have a multilayer structure, each of the first and secondtouch conductive layers may include multiple metal layers. The multiplemetal layers may have a triple-layer structure of Ti/Al/Ti. When formedto have a multilayer structure, each of the first and second touchconductive layers may include at least one metal layer and at least onetransparent conductive layer.

The first and second touch conductive layers may have a mesh shape. Inthis case, the first and second touch conductive layers may not bevisible to the user.

The first touch conductive layer may include the connecting electrodesBE. The second touch conductive layer may include the first touchelectrodes TE and the second touch electrodes RE. The first touchelectrodes TE may be connected to the connecting electrodes BE throughthird contact holes CNT3 which penetrate the first touch insulatinglayer 191. Accordingly, the first touch electrodes TE and the secondtouch electrodes RE can be prevented from being short-circuited at theintersections therebetween.

In order to prevent the aperture ratio of the pixels PX from decreasing,the first touch electrodes TE, the second touch electrodes RE, and theconnecting electrodes BE may be disposed to overlap with thepixel-defining layer 176.

Each of the first and second touch insulating layers 191 and 192 mayhave a single-layer structure or a multilayer structure. Each of thefirst and second touch insulating layers 191 and 192 may include aninorganic material, an organic material, or a combination thereof.

Each of the first and second touch insulating layers 191 and 192 mayinclude an organic film and/or an inorganic film. The inorganic film mayinclude at least one of aluminum oxide, titanium oxide, silicon oxide,silicon oxynitride, zirconium oxide, and hafnium oxide. The organic filmmay include at least one of an acrylic resin, a methacrylic resin,polyisoprene, a vinyl resin, an epoxy resin, a urethane resin, acellulose resin, a siloxane resin, a PI resin, a PA resin, and aperylene resin.

A display device according to another exemplary embodiment of theinvention will hereinafter be described. Like reference numeralsindicate like elements throughout the present disclosure, and thus,descriptions thereof will be omitted or at least simplified.

FIG. 11 is a plan view of a display device according to anotherexemplary embodiment of the invention. FIG. 12 is an enlarged plan viewof an area A of FIG. 11 .

Referring to FIGS. 11 and 12 , a display device 1_1 differs from thedisplay device 1 of FIGS. 6 through 10 in the pattern of arrangement ofdummy patterns DP_1.

Specifically, the dummy patterns DP_1 may include third dummy patternsDP3′ and fourth dummy patterns DP4′, and the third dummy patterns DP3′and the fourth dummy patterns DP4′ may be disposed in a second area DABof a display area DA.

The third dummy patterns DP3′ may extend in a first direction W1 in aplan view and may be disposed parallel to one another.

The fourth dummy patterns DP4′ may extend in a second direction W2 in aplan view and may be disposed parallel to one another. A plurality offourth dummy patterns DP4′ may be disposed between the third dummypatterns DP3′ as island patterns.

For example, the third dummy patterns DP3′ may have a greater averagelength than the fourth dummy patterns DP4′.

For example, the dummy patterns DP_1 may not overlap with first throughk-th connecting wires DM1 through DMk in a plan view. Accordingly, gapsG may be formed between the dummy patterns DP_1 and the first throughk-th connecting wires DM1 through DMk.

The dummy patterns DP_1 may not overlap with one another. Accordingly,gaps G may also be formed between the dummy patterns DP_1.

For example, as illustrated in FIG. 12 , the gaps G formed in thedisplay device 1_1 may overlap with first touch electrodes TE, secondtouch electrodes RE, and connecting electrodes BE of a touch sensinglayer TSL.

As described above, since the dummy patterns DP_1 include first dummypatterns DP1, second dummy patterns DP2, the third dummy patterns DP3′,and the fourth dummy patterns DP4′, the dummy patterns DP_1 can form alattice pattern shape in the display area DA together with connectingwires 146. Also, as described above, since the first touch electrodesTE, the second touch electrodes RE, and the connecting electrodes BEblock the gaps G formed in the display area DA, the reflection ofexternal light by the gaps G can be prevented, and smudges caused by thegaps G can be prevented from becoming visible.

A display device according to another exemplary embodiment of theinvention will hereinafter be described.

FIG. 13 is a plan view of a display device according to anotherexemplary embodiment of the invention. FIG. 14 is an enlarged plan viewof an area A of FIG. 13 .

Referring to FIGS. 13 and 14 , a display device 1_2 differs from thedisplay device 1 of FIGS. 6 through 10 in the pattern of arrangement ofdummy patterns DP_2.

Specifically, the dummy patterns DP_2 may include fifth dummy patternsDP5 which are disposed in a second area DAB of a display area DA.

The fifth dummy patterns DP5 may be arranged in a lattice pattern formin and across the second area DAB. That is, the fifth dummy patterns DP5may include a plurality of column patterns which extend in a firstdirection W1 and a plurality of row patterns which extend in a seconddirection W2. The column patterns may be disposed to intersect, andoverlap with, the row patterns. No gaps may be formed in the second areaDAB where the fifth dummy patterns DP5 are disposed. Gaps G may beformed only at the interface between a first area DAA and the secondarea DAB between the fifth dummy patterns DP5 and first through k-thconnecting wires DM1 through DMk.

As illustrated in FIG. 14 , the gaps G formed in the display area DA mayoverlap with first touch electrodes TE, second touch electrodes RE, andconnecting electrodes BE of a touch sensing layer TSL.

As described above, since the dummy patterns DP_2 include the fifthdummy patterns DP5, which are formed as lattice patterns, the fifthdummy patterns DP5 may form a lattice pattern shape in the display areaDA together with connecting wires 146. Also, as described above, sincethe first touch electrodes TE, the second touch electrodes RE, and theconnecting electrodes BE block the gaps G formed in the display area DA,the reflection of external light by the gaps G can be prevented, andsmudges caused by the gaps G can be prevented from becoming visible.

A display device according to another exemplary embodiment of theinvention will hereinafter be described.

FIG. 15 is a plan view of a display device according to anotherexemplary embodiment of the invention. FIG. 16 is an enlarged plan viewof an area A of FIG. 15 .

Referring to FIGS. 15 and 16 , a display device 1_3 differs from thedisplay device 1 of FIGS. 6 through 10 in that connecting wires 146′include protruding wire patterns 146P, and that dummy patterns DP_3include first protruding dummy patterns DPP1 and second protruding dummypatterns DPP2.

Specifically, the connecting wires 146′ may include the protruding wirepatterns 146P in a first area DAA of a display area DA. The protrudingwire patterns 146P may include first protruding wire patterns 146P1which are projected in a first direction W1, second protruding wirepatterns 146P2 which are projected in the opposite direction of thefirst direction W1, third protruding wire patterns 146P3 which areprojected in a second direction W2, and fourth protruding wire patterns146P4 which are projected in the opposite direction of the seconddirection W2.

The first protruding wire patterns 146P1 may be parallel to the secondprotruding wire patterns 146P2. Columns of first protruding wirepatterns 146P1 may be aligned with columns of second protruding wirepatterns 146P2. The first protruding wire patterns 146P1 and the secondprotruding wire patterns 146P2 may overlap with first through m-th datawires D1 through Dm.

The distance between the first protruding wire patterns 146P1 may be thesame as the distance in the second direction W2 between the firstthrough k-th connecting wires DM1 through DMk. Also, the distancebetween the first protruding wire patterns 146P1 may be the same as thedistance in the second direction W2 between the first m-th data wires D1through Dm.

The distance between the second protruding wire patterns 146P2 may bethe same as the distance in the second distance W2 between the firstprotruding wire patterns 146P1.

The third protruding wire patterns 146P3 may be parallel to the fourthprotruding wire patterns 146P4. Rows of third protruding wire patterns146P3 may be aligned with rows of fourth protruding wire patterns 146P4.

The distance between the third protruding wire patterns 146P3 may be thesame as the distance in the first distance W1 between the first throughk-th connecting wires DM1 through DMk.

The distance between the fourth protruding wire patterns 146P4 may bethe same as the distance in the first distance W1 between the thirdprotruding wire patterns 146P3.

The first protruding wire patterns 146P1 and/or the second protrudingwire patterns 146P2 may form a right angle with the third protrudingwire patterns 146P3 and/or the fourth protruding wire patterns 146P4.

The first protruding wire patterns 146P1 and/or the second protrudingwire patterns 146P2 may have a greater average length than the thirdprotruding wire patterns 146P3 and/or the fourth protruding wirepatterns 146P4.

For example, the dummy patterns DP_3 may include, in a second area DABof the display area DA, sixth dummy patterns DP6, the first protrudingdummy patterns DPP1, and the second protruding dummy patterns DPP2, andthe first protruding dummy patterns DPP1 and the second protruding dummypatterns DPP2 may be projected from the sixth dummy patterns DP6.

Specifically, the sixth dummy patterns DP6 may extend in the seconddirection W2, the first protruding dummy patterns DPP1 may be projectedfrom the sixth dummy patterns DP6 in the first direction W1, and thesecond protruding dummy patterns DPP2 may be projected from the sixthdummy patterns DP6 in the opposite direction of the first direction W1.

The sixth dummy patterns DP6 may be parallel to the second portions ofthe first through k-th connecting wires DM1 through DMk.

The distance between the sixth dummy patterns DP6 may be the same as thedistance in the first direction W1 between the first through k-thconnecting wires DM1 through DMk. Also, the distance between the sixthdummy patterns DP6 may be the same as the distance in the firstdirection W1 between the third protruding wire patterns 146P3 and/orbetween the fourth protruding wire patterns 146P4.

The first protruding dummy patterns DPP1 may be parallel to the secondprotruding dummy patterns DPP2. Columns of first protruding dummypatterns DPP1 may be aligned with columns of second protruding dummypatterns DPP2. Also, the columns of first protruding dummy patterns DPP1and the columns of second protruding dummy patterns DPP2 may be alignedwith columns of first protruding wire patterns 146P1 and columns ofsecond protruding wire patterns 146P2.

The first protruding dummy patterns DPP1 and the second protruding dummypatterns DPP2 may overlap with the first through m-th data wires D1through Dm.

The distance between the first protruding dummy patterns DPP1 may be thesame as the distance in the second direction W2 between the firstthrough k-th connecting wires DM1 through DMk. Also, the distancebetween the first protruding dummy patterns DPP1 may be the same as thedistance in the second direction W2 between the first through m-th datawires D1 through Dm. Also, the distance between the first protrudingdummy patterns DPP1 may be the same as the distance in the seconddirection W2 between the first protruding wire patterns 146P1 and/orbetween the second protruding wire patterns 146P2.

The distance between the second protruding dummy patterns DPP2 may bethe same as the distance in the second direction W2 between the firstprotruding dummy patterns DPP1.

For example, the first protruding wire patterns 146P1 may not overlapwith the second protruding wire patterns 146P2. Accordingly, gaps G maybe formed between the first protruding wire patterns 146P1 and thesecond protruding wire patterns 146P2.

Also, the third protruding wire patterns 146P3 may not overlap with thefourth protruding wire patterns 146P4. Accordingly, gaps G may be formedbetween the third protruding wire patterns 146P3 and the fourthprotruding wire patterns 146P4.

Also, the first protruding dummy patterns DPP1 may not overlap with thesecond protruding dummy patterns DPP2. Accordingly, gaps G may be formedbetween the first protruding dummy patterns DPP1 and the secondprotruding dummy patterns DPP2.

As illustrated in FIG. 16 , the gaps G formed in the display device 1_3may overlap with first touch electrodes TE, second touch electrodes RE,and connecting electrodes BE of a touch sensing layer TSL.

As described above, since the connecting wires 146′ include the firstprotruding wire patterns 146P1, the second protruding wire patterns146P2, the third protruding wire patterns 146P3, and the fourthprotruding wire patterns 146P4 and the dummy patterns DP_3 include thefirst protruding dummy patterns DPP1 and the second protruding dummypatterns DPP2, which are both projected from the sixth protruding dummypatterns DP6, a lattice pattern shape can be formed in and across thedisplay area DA. Also, as described above, since the first touchelectrodes TE, the second touch electrodes RE, and the connectingelectrodes BE block the gaps G formed in the display area DA, thereflection of external light by the gaps G can be prevented, and smudgescaused by the gaps G can be prevented from becoming visible.

FIGS. 15 and 16 illustrate that the sixth dummy patterns DP6 extend inthe second direction W2, and that the first protruding dummy patternsDPP1 and the second protruding dummy patterns DPP2 are projected fromthe sixth dummy patterns DP6 in the first direction W1, but theinventive concept is not limited thereto. Alternatively, the sixth dummypatterns DP6 may extend in the first direction W1, and the firstprotruding dummy patterns DPP1 and the second protruding dummy patternsDPP2 may be projected from the sixth dummy patterns DP6 in the seconddirection W2.

A display device according to another exemplary embodiment of theinvention will hereinafter be described.

FIG. 17 is a plan view of a display device according to anotherexemplary embodiment of the invention. FIG. 18 is an exemplarycross-sectional view taken along line XVIII-XVIII′ of FIG. 17 .

Referring to FIGS. 17 and 18 , a display device 1_4 differs from thedisplay device 1 of FIGS. 4 through 10 in that shielding patterns BP arefurther disposed on dummy patterns DP.

Specifically, the shielding patterns BP may be disposed in and across adisplay area DA. The shielding patterns BP may extend in a firstdirection W1 in a plan view and may be disposed parallel to one another.

The shielding patterns BP may be disposed on a fifth insulating layer175. The shielding patterns BP may be disposed in the same layer as afirst electrode layer 150. The shielding patterns BP may include anopaque conductive material. The shielding patterns BP may receive thesame voltage as a first power supply voltage ELVDD which is applied todriving transistors.

The shielding patterns BP may overlap with gaps G formed between thedummy patterns DP and first through k-th connecting wires DM1 throughDMk. Also, the shielding patterns BP may overlap with gaps G formedbetween the dummy patterns DP. Accordingly, since the shielding patternsBP block the gaps G between the dummy patterns DP and between the dummypatterns DP and connecting wires 146, smudges caused by the gaps G canbe prevented from becoming visible.

FIGS. 17 and 18 illustrate that the shielding patterns BP are formed ascolumn patterns extending in the first direction W1, but the presentdisclosure is not limited thereto. Alternatively, the shielding patternsBP may be formed as row patterns extending in the second direction W2 oras lattice patterns consisting of column patterns extending in the firstdirection W1 and row patterns extending in the second direction W2.

A display device according to another exemplary embodiment of theinvention will hereinafter be described. FIG. 19 is another exemplarycross-sectional view taken along line XVIII-XVIII′ of FIG. 17 .

Referring to FIG. 19 , a display device 1_5 differs from the displaydevice 1_4 of FIGS. 17 and 18 in that shielding patterns BP′ aredisposed on a sixth insulating layer 175′.

The sixth insulating layer 175′ may be disposed between a fifthinsulating layer 175 and a first electrode layer 150. The sixthinsulating layer 175′ may be formed as a via layer together with thefifth insulating layer 175.

As already described above, the shielding patterns BP′ may be disposedon the sixth insulating layer 175′. Since the shielding patterns BP′block gaps G formed in a display area DA, the reflection of externallight by the gaps G can be prevented, and smudges caused by the gaps Gcan be prevented from becoming visible.

Although certain exemplary embodiments have been described herein, otherembodiments and modifications will be apparent from this description.Accordingly, the inventive concepts are not limited to such embodiments,but rather to the broader scope of the appended claims and variousobvious modifications and equivalent arrangements as would be apparentto a person of ordinary skill in the art.

What is claimed is:
 1. A display device including a display area and anon-display area, the display device comprising: a plurality of datawires disposed in the display area and in the non-display area; aplurality of connecting wires disposed in the display area and connectedto the data wires; a plurality of dummy patterns disposed in the displayarea in the same layer as the connecting wires; a plurality of pixelsdisposed in the display area; and conductive patterns disposed on theplurality of connecting wires, wherein: the conductive patterns includean opaque conductive material; first gaps are defined between theplurality of connecting wires and the plurality of dummy patterns; andthe conductive patterns overlap with the first gaps; wherein theplurality of connecting wires comprise a plurality of protruding wirepatterns and the plurality of dummy patterns comprise a dummy patternand a plurality of protruding dummy patterns; wherein the plurality ofconnecting wires and the plurality of dummy patterns form a latticepattern shape in and across the display area.
 2. The display device ofclaim 1, wherein: the non-display area includes first and secondnon-display areas; and the plurality of connecting wires extend from thefirst non-display area and are connected to the data wires in the secondnon-display area through the display area.
 3. The display device ofclaim 1, wherein the conductive patterns are disposed in the displayarea and comprise: a plurality of first touch electrodes arranged inmultiple columns along a first direction; and connecting electrodesconnecting the first touch electrodes.
 4. The display device of claim 3,wherein: the conductive patterns are disposed in the display area andcomprise a plurality of second touch electrodes arranged in multiplerows along a second direction that intersects the first direction; andthe first touch electrodes do not overlap with the second touchelectrodes.
 5. The display device of claim 1, wherein: the plurality ofprotruding wire patterns projected from first sides of the plurality ofconnecting wires; second gaps are defined between the plurality ofprotruding wire patterns; and the conductive patterns further overlapwith the fourth gaps.
 6. The display device of claim 5, wherein: theplurality of protruding wire patterns comprise first protruding wirepatterns which are projected in a first direction and second protrudingwire patterns which are projected in the opposite direction of the firstdirection; and the second gaps are disposed between the first protrudingwire patterns and the second protruding wire patterns.
 7. The displaydevice of claim 5, wherein: the plurality of protruding wire patternscomprise: third protruding wire patterns which are projected in a seconddirection that intersects the first direction; and fourth protrudingwire patterns which are projected in the opposite direction of thesecond direction; and the third gaps are disposed between the thirdprotruding wire patterns and the fourth protruding wire patterns.
 8. Thedisplay device of claim 5, wherein: the plurality of protruding dummypatterns comprise first protruding dummy patterns and second protrudingdummy patterns which are both projected from the the dummy pattern;fourth gaps are defined between the first protruding dummy patterns andthe second protruding dummy patterns; and the conductive patternsfurther overlap with the fourth gaps.